Inho Lee

MAX-Phase Films Overcome Scaling Limitations to the Resistivity of Metal Thin Films.

Sang Woon Lee, J. Shim, Ju Young Sung, 2021, ACS applied materials & interfaces.

From C4 to micro-bump: Adapting lead free solder electroplating processes to next-gen advanced packaging applications

Pedro O. Lopez-Montesinos, J. Calvert, Yi Qin, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Direct consolidation of TiAlX alloy from elemental powder mixture

J. Lee, H. M. Kim, S. Hwang, 1994 .

Formation and growth behavior of intermetallic compound phases in the interfacial reaction of solid Fe / liquid Zn at 450 °C

R. Kainuma, I. Ohnuma, Inho Lee, 2021 .

Micro-Vickers Hardness of Intermetallic Compounds in the Zn-rich Portion of Zn–Fe Binary System

R. Kainuma, I. Ohnuma, Inho Lee, 2018, ISIJ International.

Electrical Properties and Heating Performance of Polyurethane Hybrid Nanocomposite Films Containing Graphite and MWNTs

Min Ho Jee, Doo Hyun Baik, Jong Hwan Lee, 2013 .

Enabling Low-Temperature Bonding in Advanced Packaging Using Electrodeposited Indium

J. Calvert, Inho Lee, M. Lefebvre, 2016, Electronic Components and Technology Conference.