Ling Li

Vertical and Lateral Copper Transport through Graphene Layers.

Ji Cao, Michael S Arnold, Seunghyun Lee, 2015, ACS nano.

Integrating Graphene into Future Generations of Interconnect Wires

H. Wong, Ling Li, 2018, 2018 IEEE International Electron Devices Meeting (IEDM).

Cu diffusion barrier: Graphene benchmarked to TaN for ultimate interconnect scaling

Michael S. Arnold, Ji Cao, Susmit Singha Roy, 2015, 2015 Symposium on VLSI Technology (VLSI Technology).

High-Performance p-Type Black Phosphorus Transistor with Scandium Contact.

M. Engel, H. Wong, D. Farmer, 2016, ACS nano.

In-Situ Grown Graphene Enabled Copper Interconnects With Improved Electromigration Reliability

H. Wong, Zhongwei Zhu, Ling Li, 2019, IEEE Electron Device Letters.

BEOL compatible graphene/Cu with improved electromigration lifetime for future interconnects

Tao Wang, H.-S. Philip Wong, Alex Yoon, 2016, 2016 IEEE International Electron Devices Meeting (IEDM).