Jong Bok Kim

Process effects of double step DRIE and Ni–Co electroplating for a trench-type cantilever probe for a fine-pitched MEMS probe card

Bonghwan Kim, Bum-Jin Park, Jong Bok Kim, 2009 .

A robust MEMS probe card with vertical guide for a fine pitch test

Hyeon Cheol Kim, Kukjin Chun, Bong-Hwan Kim, 2007 .

Planarization and fabrication of bridges across deep grooves or holes in silicon using a dry film photoresist followed by an etch back

Bonghwan Kim, Jong Bok Kim, 2017 .