K. Otiaba
发表
Effects of thermal interface materials (solders) on thermal performance of a microelectronic package
Nduka Nnamdi (Ndy) Ekere,
S. Mallik,
M. Ekpu,
2012,
2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
K. Otiaba,
2013
.
P. K. Bernasko,
S. Mallik,
R. Bhatti,
2012
.
M. Ekpu,
R. Bhatti,
K. Otiaba,
2013
.
Nduka Nnamdi (Ndy) Ekere,
M. Ekpu,
R. Bhatti,
2011,
2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Nduka Nnamdi (Ndy) Ekere,
S. Mallik,
E. Amalu,
2011
.
Nduka Nnamdi (Ndy) Ekere,
S. Mallik,
E. Amalu,
2011,
18th European Microelectronics & Packaging Conference.
Nduka Nnamdi (Ndy) Ekere,
S. Mallik,
E. Amalu,
2011,
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011).
Emeka H. Amalu,
M. O. Alam,
Sabuj Mallik,
2011,
Microelectron. Reliab..
Michael Okereke,
R. S. Bhatti,
Kenny C. Otiaba,
2014
.
Emeka H. Amalu,
M. O. Alam,
Sabuj Mallik,
2012,
Microelectron. Reliab..
Nduka Nnamdi (Ndy) Ekere,
S. Mallik,
E. Amalu,
2011,
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011).
Ndy Ekere,
Sabuj Mallik,
R. S. Bhatti,
2013
.
Emeka H. Amalu,
Ndy Ekere,
Sabuj Mallik,
2011
.
Sabuj Mallik,
R. S. Bhatti,
Kenny C. Otiaba,
2014,
Microelectron. Reliab..
S. Mallik,
M. Ekpu,
R. Bhatti,
2013
.
Sabuj Mallik,
R. S. Bhatti,
Kenny C. Otiaba,
2014,
Microelectron. J..