Zhijie Ding
发表
J. Mauro,
Y. Yue,
Seong H. Kim,
2020
.
Xiangeng Meng,
Zhiwen Zhu,
Zhaoling Wei,
2018,
International Journal of Applied Ceramic Technology.
Zhifu Liu,
Yu Guo,
Zhijie Ding,
2018,
Journal of Materials Science: Materials in Electronics.
Huifen Peng,
Zhijie Ding,
Weibing Guo,
2021,
Materials Research Express.
C. Meng,
M. Cui,
Xuchun Wang,
2019,
Materials Letters.
J. Mauro,
Seong H. Kim,
Zhijie Ding,
2021
.
Zhijie Ding,
Weibing Guo,
Cuixin Chen,
2022,
Materials Today Communications.
Zhifu Liu,
Yu Guo,
Xiangju Ye,
2017,
Journal of Materials Science: Materials in Electronics.
Zhijie Ding,
Weibing Guo,
Cuixin Chen,
2022,
Materials Letters.
Zhijie Ding,
Junhua Chen,
Miaomiao Jiang,
2022,
SSRN Electronic Journal.
Interfacial bonding mechanisms in ultrasonic-assisted soldered Si/Cu joint using Sn-3.5Ag-4Al solder
Wenzhao Li,
Zhijie Ding,
Weibing Guo,
2023,
Materials Characterization.
Zhijie Ding,
Weibing Guo,
Cuixin Chen,
2023,
Materials Science and Engineering: A.