N. Kumar

Thermal stability of copper Through-Silicon Via barriers during IC processing

Eric Beyne, Deniz S. Tezcan, Philippe Soussan, 2011, 2011 IEEE International Interconnect Technology Conference.

On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing

E. Beyne, A. Redolfi, K. Croes, 2013 .