B. Aventurier

发表

Through silicon vias technology for CMOS image sensors packaging

X. Baillin, C. Brunet-Manquat, N. Sillon, 2008, 2008 58th Electronic Components and Technology Conference.

Study of the pixel-pitch reduction for HgCdTe infrared dual-band detectors

O. Gravrand, Jean-Paul Chamonal, Gérard Destefanis, 2004 .

Wafer level packaging technology development for CMOS image sensors using Through Silicon Vias

C. Brunet-Manquat, N. Sillon, D. Henry, 2008, 2008 2nd Electronics System-Integration Technology Conference.

19-6: Invited Paper: A Novel Process for Fabricating High-Resolution and Very Small Pixel-pitch GaN LED Microdisplays

M. Charles, F. Templier, B. Aventurier, 2017 .

P-183: Study of Electrical Probing through Thin-film Encapsulation Made of Al2O3 Films Deposited by Low Temperature ALD onto Different Metallic Underlayers

V. Delaye, T. Maindron, A. Vandeneynde, 2017 .

Processing and characterization of high resolution GaN/InGaN LED arrays at 10 micron pitch for micro display applications

François Templier, Anis Daami, Ludovic Dupré, 2017, OPTO.

75-1: Invited Paper: GaN-based Emissive Microdisplays: A Very Promising Technology for Compact, Ultra-high Brightness Display Systems

Bertrand Dupont, François Templier, Denis Sarrasin, 2016 .

Analysis of IGZO Thin-Film Transistors by XPS and Relation With Electrical Characteristics

Olivier Renault, Bernard Aventurier, Francois Templier, 2013, Journal of Display Technology.

Investigation of Al2O3 barrier film properties made by atomic layer deposition onto fluorescent tris-(8-hydroxyquinoline) aluminium molecular films

T. Maindron, N. Rochat, B. Aventurier, 2013 .

Influence of size-reduction on the performances of GaN-based micro-LEDs for display application

François Templier, Ludovic Dupré, Bernard Aventurier, 2017 .

25‐4: Investigation and Improvement of 10μm Pixel‐pitch GaN‐based Micro‐LED Arrays with Very High Brightness

F. Templier, B. Aventurier, A. Daami, 2017 .

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer

S. Moreau, C. Dubarry, B. Aventurier, 2021, 2021 IEEE International 3D Systems Integration Conference (3DIC).

Influence of process steps on the performance of microcrystalline silicon thin film transistors

François Templier, Bernard Aventurier, Pere Roca i Cabarrocas, 2007 .

Fabrication of high performance low temperature poly-silicon backplanes on metal foil for flexible active-matrix organic light emission diode displays

Patrick M. Martin, F. Templier, B. Aventurier, 2007 .

Quantitative dopant profiling of laser annealed focused ion beam-prepared silicon p-n junctions with nanometer-scale resolution

J. Hartmann, A. Chabli, D. Cooper, 2008 .

Impact of Passivation Conditions on Characteristics of Bottom-Gate IGZO Thin-Film Transistors

Bernard Aventurier, Francois Templier, Thi Thu Thuy Nguyen, 2015, Journal of Display Technology.

Impact of hydrogen diffusion on electrical characteristics of IGZO TFTs passivated by SiO2 or Al2O3

Thi Thu Thuy Nguyen, T. Terlier, J. Barnes, 2014, 2014 21st International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD).