O. Anspach

Challenges associated with diamond wire sawing when generating reduced thickness mono-crystalline silicon wafers

R. P. Brooker, Joseph Walters, K. Sunder, 2017, 2017 IEEE 44th Photovoltaic Specialist Conference (PVSC).

Challenges associated with diamond wire sawing when generating reduced thickness mono-crystalline silicon wafers

R. P. Brooker, Joseph Walters, K. Sunder, 2016, 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC).

Inline quality rating of multi‐crystalline wafers based on photoluminescence images

Thomas Brox, Stefan Rein, Matthias Demant, 2016 .

Oriented lithium disilicate glass–ceramics prepared by electrochemically induced nucleation

C. Rüssel, R. Keding, O. Anspach, 2005 .

Loss of wire tension in the wire web during the slurry based multi wire sawing process

D. Meißner, T. Wagner, K. Sunder, 2014 .

On the Correlation of Surface Roughness to Mechanical Strength and Reflectivity of Silicon Wafers

J. Hirsch, O. Anspach, S. Schoenfelder, 2014 .

Structured wire: From single wire experiments to multi-crystalline silicon wafer mass production

K. Sunder, O. Anspach, B. Hurka, 2014 .