Ting Cheng

Thermal analysis and optimization of multiple LED packaging based on a general analytical solution

Sheng Liu, Suyi Huang, Xiaobing Luo, 2010 .

Thermal analysis and optimization of multiple LED packaging based on a general analytical solution

Suyi Huang, Xiaobing Luo, Sheng Liu, 2009, 2009 59th Electronic Components and Technology Conference.

Simulation on thermal characteristics of LED chips for design optimization

Xiaobing Luo, Z. Gan, Suyi Huang, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Design and optimization of horizontally-located plate fin heat sink for high power LED street lamps

Sheng Liu, Xiaobing Luo, Xiaobing Luo, 2009, 2009 59th Electronic Components and Technology Conference.

Effect of melting temperature and amount of the phase change material (PCM) on thermal performance of hybrid heat sinks

Run Hu, Jinyan Hu, Xiaobing Luo, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Calculation of effective thermal conductivity of silicone matrix embedded with particulate phosphors in white led packages by 2D/3D unit cell method

Xiaobing Luo, Run Hu, Sheng Liu, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Phosphor distribution optimization to decrease the junction temperature in white pc-LEDs by genetic algorithm

Xiaobing Luo, Lan Li, Run Hu, 2014 .