W. Hong

发表

Study on the degradation of different types of backsheets used in PV module under accelerated conditions

Won Sik Hong, Changwoon Han, Namsu Kim, 2014 .

Effect of oxygen on pressureless silver sintering in a nitrogen atmosphere

Dajung Kim, Chulmin Oh, W. Hong, 2019, Journal of Materials Science: Materials in Electronics.

Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards

Chulmin Oh, W. Hong, 2019, Journal of Electronic Materials.

Copper electrochemical migration growth in an air HAST

Sang‐Hyun Oh, Keun-Soo Kim, Dajung Kim, 2019, Microelectronics Reliability.

Relaibility Validation Methodology for Implementation Pb-free Solder to Military Electronics

Chulmin Oh, W. Hong, Jaesseong Jeong, 2011 .

Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders

Junghwan Bang, Chulmin Oh, W. Hong, 2015, Journal of Materials Science: Materials in Electronics.

Accelerated Thermo-Mechanical Fatigue Life of Pb-Free Solder Joints for PZT Ceramic Resonator

Chulmin Oh, W. Hong, Noh-Chang Park, 2009 .

Creep mechanism fractography analysis on SnPb eutectic solder joint failure

Changwoon Han, N. Park, Chulmin Oh, 2009, 2009 European Microelectronics and Packaging Conference.

PoF Based Accelerated Life Prediction with 3 Dimensional Packaging Technology Development

Won-Sik Hong, Chulmin Oh, Chulmin Oh, 2009 .

Evaluation of solder joint reliability in flip-chip packages during accelerated testing

Dae-Gon Kim, Won Sik Hong, Jong-Woong Kim, 2005 .

Pressureless Silver Sintering of Silicon-Carbide Power Modules for Electric Vehicles

Chulmin Oh, W. Hong, Yong-Tae Joo, 2020, JOM.

Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate

Chulmin Oh, W. Hong, M. Kim, 2019, Journal of Electronic Materials.

Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module

Dajung Kim, Chulmin Oh, W. Hong, 2018, Journal of Electronic Materials.

Electrical and Microstructural Reliability of Pressureless Silver-Sintered Joints on Silicon Carbide Power Modules Under Thermal Cycling and High-Temperature Storage

W. Hong, K. Hong, M. Kim, 2021, Journal of Electronic Materials.

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

Chulmin Oh, J. Moon, Chulmin Oh, 2016, Journal of Electronic Materials.

Creep lifetime prediction of solder joint for heat sink assembly

Changwoon Han, Nochang Park, Chulmin Oh, 2010, Microelectron. Reliab..

EFFECT OF COMPONENT DENSITY ON SN-3 . 0 AG-0 . 5 CU SOLDER JOINT RELIABILITY UNDER HARSH ENVIRONMENT

Chulmin Oh, W. Hong, J. Yu, 2018 .

Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration

N. Kang, W. Hong, Hyunbin Nam, 2021 .

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

N. Kang, Junghwan Bang, Yujin Park, 2017 .

Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes

Seung-Boo Jung, Jeong-Won Yoon, Bo-In Noh, 2009 .

Accelerated life test of high power white light emitting diodes based on package failure mechanisms

Joong Soon Jang, K. T. Kim, J. H. Han, 2011, Microelectron. Reliab..

Design and Experimental Evaluation of Transfer-Molded 650 V Super-Junction mosfet Power Module for Industrial Applications

S. Yoon, Jaejin Jeon, W. Hong, 2021, IEEE Transactions on Industry Applications.

Industrial 650V 4-Pack Super-Junction MOSFET Module using Transfer Molding Process

S. Yoon, W. Hong, Jangmuk Lim, 2019, European Conference on Cognitive Ergonomics.

Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics

Won Sik Hong, Do Seop Kim, Chul Min Oh, 2013, Journal of Electronic Materials.

Degradation Behavior of Eutectic and Pb-free Solder Plated Ribbon in Crystalline Silicon Photovoltaic Module

N. Park, W. Hong, Ju-hee Kim, 2014 .

Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test

W. Hong, Mi-Song Kim, Myeongin Kim, 2022, Journal of Welding and Joining.

Bonding Property and Reliability for Press-fit Interconnection

Won Sik Hong, Sangjoo Oh, Dajung Kim, 2019 .

Cu Corrosion Test Method for Lead-Free Solders

Keun-Soo Kim, Chulmin Oh, W. Hong, 2017 .

Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement

Chulmin Oh, W. Hong, Noh-Chang Park, 2007 .

Analysis for the degradation mechanism of photovoltaic ribbon wire under thermal cycling

Changwoon Han, N. Park, Jae-Seong Jeong, 2011, 2011 37th IEEE Photovoltaic Specialists Conference.

Manufacturing Technology for Tape Casting and Soft Magnetic Powder Using by Recycling Scrap of Fe-Si Electrical Sheet

Sang Hyun Kim, Ji-Yeon Park, Chulmin Oh, 2016 .

Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive

Ji-Yeon Park, Chulmin Oh, W. Hong, 2018, Journal of Welding and Joining.

Degradation of Backsheets for Crystalline Photovoltaic Modules under Damp Heat Test

Namsu Kim, Dajung Kim, Chulmin Oh, 2015 .

Interfacial Reaction of Ag Bump/Cu Land Interface for B 2 it Flash Memory Card Substrate

W. Hong, S. Cha, 2012 .

Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing

W. Hong, Mi-Song Kim, Myeongin Kim, 2021, Journal of Welding and Joining.

Reliability of Au bump flip chip packages with adhesive materials using four-point bending test

Jong-Woong Kim, Seung-Boo Jung, Jeong-Won Yoon, 2009 .

In-situ Observation and Modeling of Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with OSP and ENEPIG Surface Finish

Cheolho Park, N. Kang, Jieun Yu, 2023, Electronic Materials Letters.