P. S. Shih

Gd-doped iron-oxide nanoparticles for tumour therapy via magnetic field hyperthermia

Yuh-Jiuan Lin, P. Drake, Hui-Ju Cho, 2007 .

Highly uniform microfluidic electroless interconnections for chip stacking applications

C. Kao, C. Kao, P. S. Shih, 2021 .

Development of High Copper Concentration, Low Operating Temperature, and Environmentally Friendly Electroless Copper Plating Using a Copper ‐ Glycerin Complex Solution

C. Kao, P. S. Shih, Y. Hung, 2022, Electrochimica Acta.

Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface

C. Kao, P. S. Shih, J.H. Huang, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).