M. Omiya

发表

H. Inoue, K. Kishimoto, M. Omiya, 2005 .

K. Kishimoto, M. Amagai, M. Omiya, 2005, 2005 International Symposium on Electronics Materials and Packaging.

T. Suzuki, T. Nakamura, M. Nishida, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

M. Nishida, Hisashi Sato, S. Kamiya, 2014 .

T. Suzuki, T. Nakamura, M. Nishida, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

K. Kishimoto, M. Amagai, M. Omiya, 2008, IEEE Transactions on Components and Packaging Technologies.

M. Omiya, Yuki Kato, Hiroaki Hoshino, 2014 .

Takaya Kobayashi, Masanobu Murata, M. Omiya, 2022, Engineering Fracture Mechanics.

Yun‐Jae Kim, M. Omiya, Jun-Min Seo, 2021, Engineering Fracture Mechanics.

T. Kamitani, Y. Miyazaki, M. Omiya, 2019, Computer methods in biomechanics and biomedical engineering.

K. Kishimoto, M. Amagai, M. Omiya, 2007, International Conference on Electronic Materials and Packaging.

K. Kishimoto, M. Amagai, M. Omiya, 2006, International Conference on Electronic Materials and Packaging.

K. Kishimoto, M. Amagai, M. Omiya, 2002 .

Masazumi Amagai, Masaki Omiya, Toshikazu Shibuya, 2002, Microelectron. Reliab..

Jiwang Yan, M. Omiya, A. Nakajima, 2022, Nanomanufacturing and Metrology.

M. Imanaka, M. Omiya, Noriaki Taguchi, 2019, Journal of Adhesion Science and Technology.

Toshiaki Sakurai, Kunihiro Takahashi, Tetsuo Maki, 2019, Transactions of the JSME (in Japanese).

Masaki Omiya, Toshiaki Sakurai, Kunihiro Takahashi, 2013 .

Takuma Kobayashi, M. Omiya, Hiroki Yanamori, 2011 .

M. Omiya, M. Kurokawa, 2021, Mechanics of Advanced Materials and Structures.

H. Nakatani, M. Imanaka, M. Omiya, 2022, Theoretical and Applied Fracture Mechanics.

Takaya Kobayashi, Y. Watanabe, M. Omiya, 2022, Fatigue & Fracture of Engineering Materials & Structures.

Takeshi Nokuo, Masaki Omiya, Takashi Suzuki, 2015, 2015 IEEE International Reliability Physics Symposium.

Masaki Omiya, Hisahiro Inoue, Kikuo Kishimoto, 2004 .

M. Amagai, M. Omiya, H. Inoue, 2002, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002..