Sang Hwui Lee

Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review

Kuan-Neng Chen, James J.-Q. Lu, Sang Hwui Lee, 2011, Journal of Microelectromechanical Systems.

Platinum Nanostructure Growth Using Self-Assembled Fluorocarbon Structure

J. McMahon, Jian-Qiang Lu, Zhengchun Liu, 2007 .

Exploration of the Scaling Limits of 3D Integration

Jian-Qiang Lu, Robert E. Jones, Ronald J. Gutmann, 2006 .

Unit processes for Cu/BCB redistribution layer bonding for 3D ICs

J. McMahon, R. Gutmann, Jian-Qiang Lu, 2006 .

Low Temperature Copper-Nanorod Bonding for 3D Integration

Jian Yu, Gopal G. Pethuraja, Tansel Karabacak, 2006 .

Low Temperature Wafer Bonding by Copper Nanorod Array

Jian-Qiang Lu, Toh-Ming Lu, Tansel Karabacak, 2009 .

Structure, Design and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits

Anna W. Topol, Jian-Qiang Lu, Kuan-Neng Chen, 2006, 2006 International Electron Devices Meeting.

Nano-ring-shape growth of fluorocarbon macromolecules during SiO2 etching

Jian-Qiang Lu, Sang Hwui Lee, 2010, Nanotechnology.

Wafer-Level 3D Integration Technology Platforms for ICs and MEMS

Jian-Qiang Lu, J. J. McMahon, Ronald J. Gutmann, 2005 .