K. Oota

Cure shrinkage analysis of epoxy molding compound

M. Saka, K. Oota, 2001 .

Effects of Particle Volume Fraction and Surface Modifiers on Narrow Gap Filling by Liquid Epoxy Resins Containing Silica Particles

Tomonori Fukasawa, K. Oota, Hiroyuki Shinto, 2013 .

Solid / Liquid Interfacial Structures, Surface Forces, and Rheology of Colloidal Dispersions Comprised of Silica Particles Suspended in Liquid Epoxy Resins

Tomonori Fukasawa, K. Oota, Hiroyuki Shinto, 2012 .

Development of molding compounds for BGA

K. Oota, K. Shigeno, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

Study of molding compound for BGA [package]

K. Oota, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).