M. Fujino
发表
T. Suga,
M. Fujino,
H. Terasaka,
2018
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2017,
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2016
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2016
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2015
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2014,
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Tadatomo Suga,
Naoe Hosoda,
Masahisa Fujino,
2015
.
T. Suga,
Y. Nakano,
Kentaroh Watanabe,
2014,
2014 International Conference on Electronics Packaging (ICEP).
T. Suga,
T. Someya,
M. Fujino,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2015,
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
T. Suga,
M. Fujino,
H. Terasaka,
2016
.
K. Kikuchi,
Kenji Takahashi,
M. Fujino,
2019,
Japanese Journal of Applied Physics.
T. Suga,
E. Higurashi,
Ming Li,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Kazutaka Sueshige,
Masaaki Ichiki,
Tadatomo Suga,
2013
.
Y. Okada,
T. Suga,
Y. Nakano,
2017,
2017 IEEE 44th Photovoltaic Specialist Conference (PVSC).
Y. Okada,
T. Suga,
Y. Nakano,
2016,
2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC).
T. Suga,
Y. Nakano,
Kentaroh Watanabe,
2015,
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Jenn-Ming Song,
M. Fujino,
Po-Hsiang Chiu,
2019,
JOM.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
T. Suga,
M. Fujino,
Ran He,
2016
.
T. Suga,
M. Fujino,
Ran He,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
T. Suga,
M. Fujino,
Ran He,
2016
.
T. Suga,
M. Fujino,
Ran He,
2015,
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
T. Suga,
M. Fujino,
Ran He,
2014,
IEEE CPMT Symposium Japan 2014.
T. Suga,
Yinghui Wang,
M. Fujino,
2008,
2008 IEEE 9th VLSI Packaging Workshop of Japan.
T. Suga,
M. Fujino,
T. Matsumae,
2017
.
T. Suga,
F. Mu,
M. Fujino,
2017
.
T. Suga,
H. Baumgart,
M. Fujino,
2015,
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Mechanism of bonding and debonding using surface activated bonding method with Si intermediate layer
T. Suga,
M. Fujino,
K. Takeuchi,
2018
.
T. Suga,
M. Fujino,
K. Takeuchi,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
T. Suga,
R. He,
M. Fujino,
2015
.
T. Suga,
M. Fujino,
Terasaka Hidenori,
2015
.
T. Suga,
M. Fujino,
H. Terasaka,
2014,
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
T. Iwai,
I. Soga,
2012,
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration.
T. Suga,
K. Miyazawa,
T. Mashino,
2006
.
T. Suga,
K. Miyazawa,
M. Fujino,
2005
.
T. Suga,
M. Fujino,
K. Takeuchi,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
T. Suga,
K. Miyazawa,
M. Fujino,
2006
.
T. Suga,
M. Fujino,
T. Matsumae,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
T. Suga,
Jenn-Ming Song,
M. Fujino,
2018,
Applied Surface Science.
Tadatomo Suga,
Masahisa Fujino,
Wenhua Yang,
2013
.
T. Suga,
F. Mu,
H. Nakazawa,
2017
.
T. Suga,
E. Higurashi,
M. Fujino,
2016
.
T. Suga,
M. Fujino,
T. Matsumae,
2013,
2013 3rd IEEE CPMT Symposium Japan.
Masaaki Ichiki,
Tadatomo Suga,
Toshihiro Itoh,
2013
.
Tadatomo Suga,
Tokushi Kizuka,
Masahisa Fujino,
2004,
SPIE Micro + Nano Materials, Devices, and Applications.
Tadatomo Suga,
Ikuo Soga,
Taisuke Iwai,
2015,
Microelectron. Reliab..
T. Suga,
E. Higurashi,
Ming Li,
2012,
2012 2nd IEEE CPMT Symposium Japan.
Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acid
T. Suga,
M. Fujino,
M. Akaike,
2017
.
T. Suga,
M. Fujino,
M. Akaike,
2012,
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
T. Suga,
F. Mu,
H. Nakazawa,
2016
.
Tadatomo Suga,
Ran He,
Masahisa Fujino,
2015
.
T. Suga,
T. Sakai,
S. Sakuyama,
2017
.
T. Suga,
T. Sakai,
S. Sakuyama,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
T. Suga,
Wenhua Yang,
M. Fujino,
2013
.
T. Suga,
T. Sakai,
S. Sakuyama,
2017,
Electronic Components and Technology Conference.
T. Suga,
K. Abe,
M. Fujino,
2014,
2014 International Conference on Electronics Packaging (ICEP).
T. Suga,
M. Fujino,
K. Takeuchi,
2018
.
Tadatomo Suga,
Masahisa Fujino,
Takashi Matsumae,
2015
.
M. Fujino,
2023,
Journal of The Japan Institute of Electronics Packaging.
Tadatomo Suga,
Masahisa Fujino,
Kai Takeuchi,
2016,
2016 International Conference on Electronics Packaging (ICEP).
T. Suga,
M. Fujino,
T. Matsumae,
2014,
2014 International Conference on Electronics Packaging (ICEP).
Kentaro Abe,
Tadatomo Suga,
Masahisa Fujino,
2016,
2016 International Conference on Electronics Packaging (ICEP).
T. Suga,
K. Abe,
M. Fujino,
2015,
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).