M. Gerland

Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density

Denis Bertheau, X. Milhet, Vincenzo Caccuri, 2014, Journal of Electronic Materials.

Explosive cladding of a thin Ni-film to an aluminium alloy

J. Guin, H. Presles, M. Gerland, 2000 .

Influence of the Porous Microstructure on the Elastic Properties of Sintered Ag Paste as Replacement Material for Die Attachment

Denis Bertheau, X. Milhet, D. Mellier, 2015, Journal of Electronic Materials.