K. Otsuka

Package design for high-speed low-cost ASIC LSIs

K. Otsuka, Y. Shirai, T. Miwa, 1990, 40th Conference Proceedings on Electronic Components and Technology.

A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation

K. Otsuka, K. Otsuka, Y. Shirai, 1984 .

Characterization of a silicone gel as a coating use for corrosion protection

K. Otsuka, H. Ishida, K. Nakata, 1988, 38th Electronics Components Conference 1988., Proceedings..

A Consideration of Interaction between Burn-out of Polyvinyl Butyral Binder and Sintering of Alumina Ceramics in a Reducing Atmosphere (Part 4)

K. Otsuka, S. Ogihara, 1985 .

A Study on the Alumina Ceramics Casting Conditions by the Doctor-Blade Method and Their Effect on the Properties of Green Tape (Part 1)

K. Otsuka, Wahei Kitamura, Y. Ohsawa, 1986 .

Package Sealing and Encapsulation

K. Otsuka, D. B. Clegg, C. P. Wong, 1997 .