Sang-Yong Kim

发表

Optimization of post-CMP cleaning process for elimination of CMP slurry-induced metallic contaminations

Woo-Sun Lee, Y. Seo, Sang-Yong Kim, 2001 .

Motor-Current-Based Real-Time End Point Detection of Shallow-Trench-Isolation Chemical Mechanical Polishing Process Using High-Selectivity Slurry

Woo-Sun Lee, Yong-Jin Seo, Jin-seong Park, 2003 .

Creation mechanism of metal depression in sputtering process for aluminum interconnects

N. Kim, Woo-Sun Lee, Dong-You Choi, 2007 .

Effects of slurry filter size on the chemical mechanical polishing (CMP) defect density

Woo-Sun Lee, Y. Seo, Sang-Yong Kim, 2004 .

Reduction of process defects using a modified set-up for chemical mechanical polishing equipment

Woo-Sun Lee, Y. Seo, Sang-Yong Kim, 2003 .

The dry etching of TEOS oxide for poly-Si cantilevers in supercritical CO2

J. M. Jung, B. Choi, K. Lim, 2011 .

Facile synthesis of a NiO/NiS hybrid and its use as an efficient electrode material for supercapacitor applications

Hee-jee Kim, C. V. Gopi, Sang-Yong Kim, 2018 .

Effects of Ceria Abrasive Particle Size Distribution below Wafer Surface on In-Wafer Uniformity during Chemical Mechanical Polishing Processing

Myungjoon Kim, Taesung Kim, Ji Chul Yang, 2011 .

Yield improvement of 0.13μm Cu/low-k dual-damascene interconnection by organic cleaning process

N. Kim, Chang-I. Kim, Kang-Yeon Lee, 2007 .

Optimization of nitride films for linear pre-metal dielectric process

N. Kim, Woo-Sun Lee, Y. Seo, 2005 .

Facile synthesis of unique diamond-like structured CdMn2O4@CdMn2O4 composite material for high performance supercapacitors

Hee-jee Kim, C. V. Gopi, Chul Kim, 2018 .

Facile One-Step Synthesis of a Composite CuO/Co3O4 Electrode Material on Ni Foam for Flexible Supercapacitor Applications

Hee-jee Kim, C. V. Gopi, Sang-Yong Kim, 2017, Solar Power and Energy Storage Systems.

Preparation and properties of ethylene propylene diene rubber/multi walled carbon nanotube composites for strain sensitive materials

Kwon Taek Lim, Inpil Kang, Md. Abdul Khaleque, 2011 .

Semi-abrasive free slurry with acid colloidal silica for copper chemical mechanical planarization

N. Kim, Sang-Yong Kim, E. Chang, 2005 .

Effects of phosphoric acid stabilizer on copper and tantalum nitride CMP

N. Kim, Sang-Yong Kim, E. Chang, 2003 .

H/sub 3/PO/sub 4/ addition to slurry for Cu and TaN CMP

N. Kim, Sang-Yong Kim, E. Chang, 2003 .

Failure Analysis for High via Resistance by HDP CVD System for IMD Layer

Y. Seo, Sang-Yong Kim, Hun-Sang Chung, 2002 .

Characterization of Ultra Low-k SiOC(H) Film Deposited by Plasma-Enhanced Chemical Vapor Deposition (PECVD)

Sang-Yong Kim, 2012 .

Reduction of loading effects with the sufficient vertical profile for deep trench silicon etching by using decoupled plasma sources

N. Kim, Dong-You Choi, Sang-Yong Kim, 2009 .

Analysis of the defect density according to the slurry filter size in the chemical mechanical polishing process

Jin-seong Park, Woo-Sun Lee, Y. Seo, 2003 .

Effects of deionized water pressure and purified nitrogen gas on the chemical mechanical polishing process

Y. Seo, Sang-Yong Kim, So-young Jeong, 2002 .

An optimization of tungsten plug chemical mechanical polishing (CMP) using different consumables

Woo-Sun Lee, Y. Seo, Sang-Yong Kim, 2001 .

Design of experiment (DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing (CMP) process

Nam-Hoon Kim, N. Kim, Sang-Yong Kim, 2006 .

Determination of process margin and global planarization characteristics in the direct STI-CMP process

Y. Seo, Sang-Yong Kim, 2004 .

In-situ end point detection of the STI-CMP process using a high selectivity slurry

Yong-Jin Seo, Y. Seo, Sang-Yong Kim, 2003 .

Improvements of CMP characteristics using slurry filter and high-spray bar of de-ionized water

Y. Seo, Sung-Woo Park, Sang-Yong Kim, 2002 .

Correlation analysis between pattern and non-pattern wafer for characterization of shallow trench isolation-chemical-mechanical polishing (STI-CMP) process

Yong-Jin Seo, Y. Seo, Sang-Yong Kim, 2002 .

Effect of facility for hot spot reduction of inter-level dielectric (ILD) CMP process

Y. Seo, Sang-Yong Kim, So-young Jeong, 2001, International Symposium on Electrical Insulating Materials.

Reduction of micro-scratch using slurry filter in oxide CMP (chemical mechanical polishing) for multi-level interconnections

Y. Seo, Sang-Yong Kim, Chul-Bok Kim, 2001, International Symposium on Electrical Insulating Materials.

Reduction of micro-defects in the inter-metal dielectrics (IMD) chemical mechanical polishing (CMP) for ULSI applications

Sung-Woo Park, Sung-Woo Park, Sang-Yong Kim, 2001, Proceedings of 2001 International Symposium on Electrical Insulating Materials (ISEIM 2001). 2001 Asian Conference on Electrical Insulating Diagnosis (ACEID 2001). 33rd Symposium on Electrical and Ele.

Design of experimental optimization for ULSI CMP process applications

Sung-Woo Park, Yong-Jin Seo, Y. Seo, 2003 .

Optimization of pre-metal Dielectric (PMD) materials

Woo-Sun Lee, Y. Seo, Sang-Yong Kim, 2001 .

Global planarization characteristics of shallow trench isolation-chemical mechanical polishing process with and without reverse moat etch step

Jin-seong Park, Woo-Sun Lee, Y. Seo, 2003 .

Effects of Various Facility Factors on Chemical Mechanical Polishing Process Defects

Y. Seo, Sang-Yong Kim, 2002 .

Advantages of point of use (POU) slurry filter and high spray method for reduction of CMP process defects

Woo-Sun Lee, Yong-Jin Seo, Woo-Sun Lee, 2003 .

Stabilization of sheet resistance for metal lines by formation of etch stop layer (ESL) trench structure

N. Kim, Dong-You Choi, Sang-Yong Kim, 2010 .

A Study on the Atmospheric Pressure Control of the VARTM Process for Increasing the Fiber Volume Fraction and Reducing Void

Tae-Jun Kim, Sang-Yong Kim, Sungil Kwon, 2021 .

Signal analysis of the end point detection method based on motor current

Yong-Jin Seo, Y. Seo, Sang-Yong Kim, 2003 .

Trade-off Characteristic between Gate Length Margin and Hot Carrier Lifetime by Considering ESD on NMOSFETs of Submicron Technology

J. Kang, H. Hwang, O. Kwon, 2006 .