O. Holck

发表

An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals

B. Wunderle, J. Bonitz, S. Schulz, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Influence of conversion level on simulation results of crosslinked polymers

O. Holck, S. Tesarski, A. Wymyslowski, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Application of hybrid methods to analyse interface properties of packaging materials on miniaturized specimens

B. Michel, B. Wunderle, H. Walter, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Mechanically relevant chemical shrinkage of epoxy molding compounds

K. Lang, H. Walter, O. Wittler, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Materials in Solar Thermal Collectors

M. Heck, M. Köhl, G. Jorgensen, 2000 .

Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC

P. Ramm, B. Wunderle, U. Zschenderlein, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Pull-Out Testing of SWCNTs Simulated by Molecular Dynamics

B. Wunderle, S. Hartmann, O. Holck, 2012 .

Fracture-mechanical interface characterisation for thermo-mechanical co-design — An effcient and comprehensive method for critical mixed-mode data extraction

B. Wunderle, B. Michel, J. Keller, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

The crystallographic dependence of surface topographical features formed by energetic ion bombardment of copper

G. Carter, M. Nobes, O. Holck, 1980 .

Total backscattering of low energy heavy ions from solid surfaces

G. Sidenius, O. Holck, J. Bøttiger, 1980 .

Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC

P. Ramm, B. Wunderle, E. Auerswald, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium

B. Wunderle, T. Blaudeck, S. Schulz, 2014 .

Mechanics of CNT-palladium Interfaces for Sensor Applications Simulated with Molecular Dynamics

B. Wunderle, S. Hartmann, O. Holck, 2014 .

Molecular dynamics simulations for mechanical characterization of CNT/gold interface and its bonding strength

B. Wunderle, S. Hartmann, O. Holck, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Development of process and design criteria for stress management in through silicon vias

A. Grams, O. Wittler, M. J. Wolf, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: molecular dynamics simulations and in situ experiments using electron microscopy

B. Wunderle, J. Bonitz, S. Schulz, 2016 .

Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics

B. Wunderle, J. Bonitz, T. Blaudeck, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Molecular dynamics simulation and mechanical characterisation for the establishment of structure-property correlations for epoxy resins in microelectronics packaging applications

J. Bauer, B. Wunderle, B. Michel, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Approach for reliability of Thermal Interface Materials in battery cell sensors

K. Lang, H. Walter, O. Wittler, 2013, International Workshop on Thermal Investigations of ICs and Systems.

Influence of humidity on reliability of plastic packages

K. Lang, R. Aschenbrenner, H. Walter, 2015, 2015 European Microelectronics Packaging Conference (EMPC).

Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces

J. Bauer, B. Wunderle, O. Wittler, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach — Preliminary results

Artur Wymyslowski, Ole Holck, Sebastian J. Tesarski, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.