J. L. Harringa

Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests

B. A. Cook, B. Cook, I. Anderson, 2001 .

Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

Iver E. Anderson, B. A. Cook, B. Cook, 2002 .

Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints

Iver E. Anderson, I. Anderson, J. Harringa, 2007 .

Application of an asymmetrical four point bend shear test to solder joints

B. A. Cook, B. Cook, I. Anderson, 2001 .

Analysis of Nanostructuring in High Figure‐of‐Merit Ag1–xPbmSbTe2+m Thermoelectric Materials

Matthew J. Kramer, Duck Young Chung, Mercouri G. Kanatzidis, 2009 .

Analysis of Ce‐ and Yb‐Doped TAGS‐85 Materials with Enhanced Thermoelectric Figure of Merit

Rama Venkatasubramanian, E. M. Levin, B. Cook, 2011 .