R.V. Pucha

Design, fabrication, and reliability testing of embedded optical interconnects on package

Gee-Kung Chang, Fuhan Liu, D. Guidotti, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Novel board material technology for next-generation packaging

P. Markondeya Raj, R. Doraiswami, N. Kumbhat, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Accelerated thermal cycling: is it different for lead-free solder?

K. Kacker, S. Sitaraman, R. Pucha, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly

S. Bhattacharya, P. Markondeya Raj, R. Doraiswami, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Physics-based reliability assessment of embedded passives

M. Damani, R. Tummala, S. Sitaraman, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).