P. Crevel

Study of a 3D phenomenon during ESD stresses in deep submicron CMOS technologies using photon emission tool

G. Reimbold, C. Leroux, P. Salome, 1997, 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual.

Calibration of ASIC library for radiation tolerant space applications methodology and experiment

P. Crevel, V. Stachetti, T. Corbiere, 1991 .

Investigations on the thermal behavior of interconnects under ESD transients using a simplified thermal RC network

C. Leroux, P. Crevel, J.P. Chante, 1998, Electrical Overstress/ Electrostatic Discharge Symposium Proceedings. 1998 (Cat. No.98TH8347).

An attempt to explain thermally induced soft failures during low level ESD stresses: study of the differences between soft and hard NMOS failures

G. Reimbold, Jean-Pierre Chante, D. Lafond, 1998 .

An attempt to explain thermally induced soft failures during low level ESD stresses: study of the differences between soft and hard NMOS failures.

G. Reimbold, D. Lafond, P. Salome, 1997, Proceedings Electrical Overstress/Electrostatic Discharge Symposium.

Investigations on the thermal behavior of interconnects under ESD transients using a simplified thermal RC network

P. Crevel, Pascal Salome, Charles Leroux, 1999 .