Nobuo Ogura

Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration

Pulugurtha Markondeya Raj, Rao Tummala, Atom O. Watanabe, 2020, Journal of Electronic Materials.

First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications

Rao Tummala, Siddharth Ravichandran, Mohanalingam Kathaperumal, 2019, International Symposium on Microelectronics.