M. LeMieux

发表

Organic semiconductor-carbon nanotube bundle bilayer field effect transistors with enhanced mobilities and high on/off ratios

S. Mannsfeld, H. Lee, Z. Bao, 2008 .

Achieving Highly Conductive, Stretchable, and Washable Fabric from Reactive Silver Ink and Increased Interfacial Adhesion

Paul W. Leu, Qihan Liu, Anthony J. Galante, 2022, ACS Applied Polymer Materials.

Reactive silver inks for antiviral, repellent medical textiles with ultrasonic bleach washing durability compared to silver nanoparticles

Paul W. Leu, D. Bain, Anthony J. Galante, 2022, PloS one.

Ink-Coated Silver Films on PET for Flexible, High Performance Electromagnetic Interference Shielding and Joule Heating

Paul W. Leu, S. B. Walker, Sneh K. Sinha, 2022, ACS Applied Electronic Materials.

Stretchable and wash durable reactive silver ink coatings for electromagnetic interference shielding, Joule heating, and strain sensing textiles

Paul W. Leu, S. B. Walker, M. LeMieux, 2023, Progress in Organic Coatings.

Polymer-Embedded Silver Microgrids by Particle-Free Reactive Inks for Flexible High-Performance Transparent Conducting Electrodes

Paul W. Leu, S. B. Walker, M. LeMieux, 2021 .

Silver Meshes for Record-Performance Transparent Electromagnetic Interference Shielding

Paul W. Leu, S. B. Walker, M. LeMieux, 2023, ACS applied materials & interfaces.

Single‐ and Double‐Layer Embedded Metal Meshes for Flexible, Highly Transparent Electromagnetic Interference Shielding

M. LeMieux, Mingxuan Li, Paul W. Leu, 2024, Advanced Materials Technologies.

Flexible Embedded Metal Meshes by Sputter-Free Crack Lithography for Transparent Electrodes and Electromagnetic Interference Shielding

Jungtaek Kim, M. LeMieux, Mingxuan Li, 2024, ACS applied materials & interfaces.

EMI Shielding for System in Package using Nozzle-Less Ultrasonic Spray Coating and Silver Particle Free Ink

G. McKerricher, M. LeMieux, Sima Hannani, 2020, 2020 International Wafer Level Packaging Conference (IWLPC).