Linlin Xu

发表

H. Kuo, T. Zhai, Run Hu, 2019, ACS applied materials & interfaces.

H. Kuo, Z. Feng, J. Dai, 2019, Applied Physics Letters.

Renli Liang, J. Dai, Changqin Chen, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Yang Peng, Renli Liang, J. Dai, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Yang Peng, Hao Wang, Renli Liang, 2018, IEEE Transactions on Electron Devices.

Feng Wu, J. Dai, Changqin Chen, 2019, IEEE Transactions on Electron Devices.

Yingzhe Wang, Jincheng Zhang, Peixian Li, 2020, 2020 IEEE International Reliability Physics Symposium (IRPS).

Renli Liang, J. Dai, Changqin Chen, 2017, IEEE Transactions on Electron Devices.