R. Dufresne

Thermal characterization and challenges of advanced interconnects (Invited)

Baozhen Li, C. Christiansen, A. Kim, 2016, 2016 IEEE International Reliability Physics Symposium (IRPS).

Abrupt current increase due to space-charge-limited conduction in thin nitride–oxide stacked dielectric system

R. Jammy, Fen Chen, R. Dufresne, 2001 .

Photo-enhanced negative differential resistance and photo-accelerated time-dependent dielectric breakdown in thin nitride-oxide dielectric film

R. Jammy, Fen Chen, A. Strong, 2001 .

New breakdown data generation and analytics methodology to address BEOL and mol dielectric TDDB process development and technology qualification challenges

Fen Chen, Kai Zhao, Cathryn Christiansen, 2014, 2014 IEEE International Reliability Physics Symposium.

Layout dependence of gate dielectric TDDB in HKMG FinFET technology

Wen Liu, Roger Dufresne, Dinesh Badami, 2016, 2016 IEEE International Reliability Physics Symposium (IRPS).