E. Chua

Isothermal em as highly accelerated test method for copper damascene lines

B. H. Lim, Kin Leong, Y. Andrew, 2002, Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614).

Copper interconnect microanalysis and electromigration reliability performance due to the impact of TLP ESD

S. Redkar, I. Manna, E. Chua, 2002, 2002 Electrical Overstress/Electrostatic Discharge Symposium.

Chip package interaction analysis for 20-nm technology with thermo-compression bonding with non-conductive paste

S. Kannan, Shan Gao, R. S. Smith, 2015, Electronic Components and Technology Conference.

Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond

S. Kannan, Shan Gao, R. S. Smith, 2015 .

Study of electric field—based lifetime projection method in IMD TDDB

E. Chua, Y. K. Lim, J. Liu, 2010, 2010 IEEE International Reliability Physics Symposium.

New insight in BEOL TDDB Cu diffusion mechanism: A constant current stress approach

Tian Shen, Tommy Cahyadi, Eng Chye Chua, 2014, 2014 IEEE International Reliability Physics Symposium.