TingYen Chiang

A new analytical thermal model for multilevel ULSI interconnects incorporating via effect

Kaustav Banerjee, Krishna C. Saraswat, Ting-Yen Chiang, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Effect of via separation and low-k dielectric materials on the thermal characteristics of Cu interconnects

Kaustav Banerjee, Krishna C. Saraswat, Ting-Yen Chiang, 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).

Impact of Joule heating on scaling of deep sub-micron Cu/low-k interconnects

Ting-Yen Chiang, K. Saraswat, K.C. Saraswat, 2002, 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).

Growth of Graphitic Carbon Nitride-Incorporated ZnO Nanorods on Silicon Pyramidal Substrates for Enhanced Hydrogen Sensing Applications.

Bohr‐Ran Huang, Wen-Luh Yang, Deepa Kathiravan, 2022, ACS applied materials & interfaces.

3-D ICS DSM Interconnect Performance Modeling and Analysis

Krishna C. Saraswat, Pawan Kapur, Ting-Yen Chiang, 2003 .

ZnO-NWs/metallic glass nanotube hybrid arrays: Fabrication and material characterization

J. Chu, Chunpei Yu, Bohr‐Ran Huang, 2020, Surface and Coatings Technology.

Compact modeling and SPICE-based simulation for electrothermal analysis of multilevel ULSI interconnects

Kaustav Banerjee, Krishna Saraswat, TingYen Chiang, 2001, IEEE/ACM International Conference on Computer Aided Design. ICCAD 2001. IEEE/ACM Digest of Technical Papers (Cat. No.01CH37281).

Thermal analysis of heterogeneous 3D ICs with various integration scenarios

K.C. Saraswat, Chi On Chui, Ting-Yen Chiang, 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).