Bongtae Han

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han, 2020 .

무아레 간섭계를 이용한 BGA 패키지의 열변형 해석모델 평가

Bongtae Han, 주진원, 최용서, 2002 .

Fine leak batch testing of multiple MEMS packages

Bongtae Han, Byeng D. Youn, Changsoo Jang, 2009, MOEMS-MEMS.

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han, 2020, Journal of Electronic Packaging.

A Hybrid Approach to Investigate Effect of Flip-Chip Packaging on RF MEMS Devices Performance

Bongtae Han, Li Sun, Changsoo Jang, 2008 .

In situ measurement of gas diffusion properties of sealing polymers for MEMS packages by an optical gas leak test

Bongtae Han, Changsoo Jang, A. Goswami, 2009, MOEMS-MEMS.

Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor

Bongtae Han, Tobias Melz, Dirk Mayer, 2016, EuroSimE 2016.

Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu

Bongtae Han, Changwoon Han, 2014 .

Characterization of warpage of flip-chip pbga package and its effect on solder joint reliability

Bongtae Han, Seungbae Park, Kaushal Verma, 1999 .

Real-time warpage measurement of electronic components with variable sensitivity

Bongtae Han, D. Columbus, K. Verma, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Algorithm to Determine the Knee Point on Capacity Fade Curves of Lithium-Ion Cells

Bongtae Han, Michael Pecht, Saurabh Saxena, 2019, Energies.