S. Mahalingam

Design of underfill materials for lead free flip chip applications

A. Joshi, S. Mahalingam, K. Goray, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

S. Sitaraman, S. Tonapi, S. Mahalingam, 2006 .

System-Level Reliability Assessment of Mixed-Signal

G. Ramakrishna, Kevin M. Klein, Suresh K. Sitaraman, 2004 .

Materials, processes and reliability of mixed-signal substrates for SOP technology

V. Sundaram, Fuhan Liu, G. White, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

S. Sitaraman, A. Prabhakumar, S. Tonapi, 2008 .

The Characterization of Underfill-Passivation Interface Under Monotonic and Fatigue Loading and Its Application to Flip Chip Reliability Prediction

S. Sitaraman, S. Tonapi, S. Mahalingam, 2005 .

System-level reliability assessment of mixed-signal convergent microsystems

G. Ramakrishna, R.V. Pucha, J. Ahmad, 2004, IEEE Transactions on Advanced Packaging.

Thermal Shock Testing as a Reliability Qualification Test for Lead-Free Solder

A. Dasgupta, S. Mahalingam, K. Goray, 2006 .

Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures

G. Ramakrishna, Suresh K. Sitaraman, Raghuram V. Pucha, 2004 .

Study of interfacial crack propagation in flip chip assemblies with nano-filled underfill materials

S. Mahalingam, 2005 .