J. Thieme

Fiber Laser – New Challenges for the Materials Processing

J. Thieme, 2007 .

Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance

R. Durairaj, Nduka Nnamdi (Ndy) Ekere, S. Mallik, 2009, 2009 11th Electronics Packaging Technology Conference.