Han Ding

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages

Xunqing Shi, Xuejun Fan, B. Xie, 2009 .

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

Xunqing Shi, Xuejun Fan, B. Xie, 2009 .

New challenges in design and understanding of chip-on-glass (COG) for LCD packaging by FEA

B. Xie, Bin Xie, Han Ding, 2005, Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC..

Understanding of Delamination Mechanism of Anisotropic Conductive Film (ACF) Bonding in Thin Liquid Crystal Display (LCD) Module

B. Xie, Bin Xie, Han Ding, 2007, IEEE Transactions on Components and Packaging Technologies.