Xiaowu Hu

A Method for Equivalent Analysis of Chain Transmission

Desheng Li, Lianjin Li, Lin Hong, 2010, 2010 International Conference on Multimedia Technology.

Interfacial reaction and growth behavior of IMCs layer between Sn–58Bi solders and a Cu substrate

Zhixian Min, Yulong Li, Xiaowu Hu, 2013, Journal of Materials Science: Materials in Electronics.

Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates

Tao Xu, Leon M. Keer, Xiongxin Jiang, 2017 .

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Yi Liu, Zhixian Min, Yulong Li, 2015 .

Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification

Ke Li, Zhixian Min, Xiaowu Hu, 2013 .