T.T. Mattila

Computational Assessment of the Effects of Temperature on Wafer-Level Component Boards in Drop Tests

Jue Li, T.T. Mattila, J.K. Kivilahti, 2009, IEEE Transactions on Components and Packaging Technologies.

Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions

P. Marjamaki, T. Mattila, J. Kivilahti, 2006, IEEE Transactions on Components and Packaging Technologies.

Effect of Temperature on the Drop Reliability of Wafer-Level Chip Scale Packaged Electronics Assemblies

L. Nguyen, T.T. Mattila, J.K. Kivilahti, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Formation of thermomechanical interconnection stresses in a high-end portable product

J.S. Karppinen, T.T. Mattila, J.K. Kivilahti, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Replacement of the drop test with the vibration test — The effect of test temperature on reliability

T. Mattila, J. Kivilahti, T.T. Mattila, 2008, 2008 58th Electronic Components and Technology Conference.