C. Torregiani
发表
E. Beyne,
V. Cherman,
M. Stucchi,
2010,
3rd Electronics System Integration Technology Conference ESTC.
Impact of Ni-silicide grain orientation on the strain and stress fields induced in patterned silicon
Karen Maex,
Hugo Bender,
Jorge Kittl,
2007
.
E. Beyne,
I. De Wolf,
B. Vandevelde,
2009,
2009 15th International Workshop on Thermal Investigations of ICs and Systems.
E. Beyne,
G. Van der Plas,
V. Cherman,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
E. Beyne,
K. Croes,
G. Groeseneken,
2013,
2013 IEEE International Reliability Physics Symposium (IRPS).
E. Beyne,
I. De Wolf,
B. Vandevelde,
2009,
2009 11th Electronics Packaging Technology Conference.