F. De Crecy

ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGY

N. Sillon, S. Moreau, G. Parès, 2011 .

Mechanical resistance of fine microstructures related to particle cleaning mechanisms

Pascal Besson, Jean-Charles Barbe, Adrien Danel, 2004 .

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Pierric Gueguen, Rachid Taibi, Laurent Clavelier, 2011 .

ULTRA THIN CHIPS STACKING ON TSV SILICON INTERPOSER USING BACK-TO-FACE TECHNOLOGY

R. Anciant, G. Parès, A. Attard, 2012 .