Kuan Hsun Lu

Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2010 .

Thermo-mechanical Reliability of 3-D Interconnects Containing Through-Silicon-Vias (TSVs)

Kuan Hsun Lu, 2010 .

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Paul S. Ho, Xuefeng Zhang, Jang-Hi Im, 2007 .