C.K.Y. Wong

Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip

Kai Zhang, P.C.H. Chan, P. Chan, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Interfacial Adhesion Study for SAM Induced Covalent Bonded Copper-EMC Interface by Molecular Dynamics Simulation

Haibo Fan, M. Yuen, H. Fan, 2008, IEEE Transactions on Components and Packaging Technologies.

Prediction of Material Properties of Epoxy Materials using Molecular Dynamic Simulation

M.M.F. Yuen, C.K.Y. Wong, H.B. Fan, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Moisture diffusion study in electronic packaging using molecular dynamic simulation

M.M.F. Yuen, C.K.Y. Wong, H.B. Fan, 2006, 56th Electronic Components and Technology Conference 2006.

A new approach in measuring Cu-EMC adhesion strength by AFM [electronics packaging applications]

M. Yuen, B. Xu, H. Gu, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).