X. Deng

发表

An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

Nikhilesh Chawla, Yu-Lin Shen, X. Deng, 2004 .

Microstructure and mechanical behavior of porous sintered steels

Nikhilesh Chawla, N. Chawla, X. Deng, 2005 .

Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints

R. S. Sidhu, Nikhilesh Chawla, N. Chawla, 2005 .

Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints

Nikhilesh Chawla, Jason J. Williams, N. Chawla, 2003 .

Three-dimensional (3D) modeling of the thermoelastic behavior of woven glass fiber-reinforced resin matrix composites

Nikhilesh Chawla, N. Chawla, X. Deng, 2008 .

Deformation analysis of lap-shear testing of solder joints

Nikhilesh Chawla, Yu-Lin Shen, N. Chawla, 2005 .

Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints

R. S. Sidhu, Nikhilesh Chawla, N. Chawla, 2008 .

Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy

Nikhilesh Chawla, F. Ochoa, X. Deng, 2004 .

Residual stress characterization of Al/SiC nanoscale multilayers using X-ray synchrotron radiation

Nikhilesh Chawla, Yu-Lin Shen, N. Chawla, 2010 .

Effect of porosity and tension-compression asymmetry on the Bauschinger effect in porous sintered steels

Nikhilesh Chawla, Jason J. Williams, N. Chawla, 2005 .

Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation

Nikhilesh Chawla, K. K. Chawla, K. Chawla, 2004 .

3D Microstructure Visualization And ModelingOf The Mechanical Behavior Of Sic ParticleReinforced Aluminum Composites

N. Chawla, X. Deng, X. Deng, 2003 .