Kris Croes

发表

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation

Houman Zahedmanesh, Ivan Ciofi, Mario Gonzalez, 2016, Microelectron. Reliab..

Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices

Eric Beyne, Ingrid De Wolf, Mario Gonzalez, 2017, Microelectron. Reliab..

Intrinsic reliability of local interconnects for N7 and beyond

Ivan Ciofi, Chen Wu, W. Gao, 2015, 2015 IEEE International Reliability Physics Symposium.

High-resolution in-situ of gold electromigration: test time reduction

Jean Manca, Kris Croes, L. Tielemans, 2001, Microelectron. Reliab..

Automated Pathfinding tool chain for 3D-stacked integrated circuits: Practical case study

Federico Angiolini, Paul Marchal, Riko Radojcic, 2009, 2009 IEEE International Conference on 3D System Integration.

TEASE: A systematic analysis framework for early evaluation of FinFET-based advanced technology nodes

Diederik Verkest, Paul Zuber, Julien Ryckaert, 2013, 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC).

LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration

Philippe Roussel, Ivan Ciofi, Ingrid De Wolf, 2017, Microelectron. Reliab..

Design Technology co-optimization for N10

Diederik Verkest, Naoto Horiguchi, Aaron Thean, 2014, Proceedings of the IEEE 2014 Custom Integrated Circuits Conference.

Statistical aspects of the degradation of LDD nMOSFETs

Guido Groeseneken, Kris Croes, Jan D'Haen, 2002, Microelectron. Reliab..

Reliability Challenges Related to TSV Integration and 3-D Stacking

Eric Beyne, Wei Guo, Ingrid De Wolf, 2016, IEEE Design & Test.

Constant voltage electromigration for advanced BEOL copper interconnects

Eric Wilcox, Ingrid De Wolf, Kris Croes, 2015, 2015 IEEE International Reliability Physics Symposium.

Accelerated Device Degradation of High-Speed Ge Waveguide Photodetectors

Joris Van Campenhout, Kris Croes, Alicja Lesniewska, 2019, 2019 IEEE International Reliability Physics Symposium (IRPS).

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line

Luka Kljucar, Ingrid De Wolf, Mario Gonzalez, 2016, Microelectron. Reliab..

Reliability challenges for barrier/liner system in high aspect ratio through silicon vias

Eric Beyne, Ingrid De Wolf, Chen Wu, 2014, Microelectron. Reliab..

REDUSA: module generation by automatic elimination of superfluous blocks in regular structures

Hugo De Man, Luc Rijnders, Paul Six, 1989, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

Stress mitigation of 3D-stacking/packaging induced stresses

Eric Beyne, Houman Zahedmanesh, Luka Kljucar, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Silicon Photonics for 56G NRZ Optical Interconnects

Peter De Heyn, Joris Van Campenhout, Andy Miller, 2018, 2018 Optical Fiber Communications Conference and Exposition (OFC).

As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability

Robin Degraeve, Ingrid De Wolf, Y. Barbarin, 2014, Microelectron. Reliab..

A new degradation model and lifetime extrapolation technique for lightly doped drain nMOSFETs under hot-carrier degradation

Guido Groeseneken, Jean Manca, Kris Croes, 2001, Microelectron. Reliab..

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill

Christopher J. Wilson, Kris Croes, Alicja Lesniewska, 2020, 2020 IEEE International Reliability Physics Symposium (IRPS).

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Bart Vandevelde, Eric Beyne, Ingrid De Wolf, 2011, Microelectron. Reliab..

Insights into metal drift induced failure in MOL and BEOL

Yunlong Li, Ivan Ciofi, Chen Wu, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

A tool flow for predicting system level timing failures due to interconnect reliability degradation

Francky Catthoor, Antonis Papanikolaou, Kris Croes, 2008, GLSVLSI '08.

Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle

L. Zhao, Kris Croes, Zsolt Tokei, 2008, Microelectron. Reliab..

Microstructure simulation of grain growth in Cu Through Silicon Via using phase-field modeling

Eric Beyne, Christopher J. Wilson, Ingrid De Wolf, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Efficient system exploration and synthesis of applications with dynamic data storage and intensive data transfer

Hugo De Man, Chantal Ykman-Couvreur, Francky Catthoor, 1998, Proceedings 1998 Design and Automation Conference. 35th DAC. (Cat. No.98CH36175).

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

Ingrid De Wolf, Riet Labie, Bert Verlinden, 2012, Microelectron. Reliab..

Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing

Philippe Roussel, Ivan Ciofi, Ingrid De Wolf, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Impact of process variability on BEOL TDDB lifetime model assessment

Ivan Ciofi, Kris Croes, Jürgen Bömmels, 2015, 2015 IEEE International Reliability Physics Symposium.

Design strategy for integrating DSA via patterning in sub-7 nm interconnects

Geert Vandenberghe, H.-S. Philip Wong, Wim Dehaene, 2016, SPIE Advanced Lithography.

The first observation of p-type electromigration failure in full ruthenium interconnects

Ingrid De Wolf, Kris Croes, Zsolt Tokei, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

REDUSA: Module Generation by Automatic Elimination of Superfluous Blocks in Regular Structures

Hugo De Man, Luc Rijnders, Paul Six, 1989, 26th ACM/IEEE Design Automation Conference.

Cameleon, a Process Tolerant Symbolic Layout System

Paul Six, Kris Croes, Hugo De Man, 1987, ESSCIRC '87: 13th European Solid-State Circuits Conference.

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Eric Beyne, Luka Kljucar, Ingrid De Wolf, 2017, Microelectron. Reliab..

Design method and algorithms for directed self-assembly aware via layout decomposition in sub-7 nm circuits

Geert Vandenberghe, H.-S. Philip Wong, Wim Dehaene, 2016 .

Hardware and a Tool Chain for ADRES

Bjorn De Sutter, Steven Dupont, Hong-Seok Kim, 2006, ARC.

TSV process-induced MOS reliability degradation

Eric Beyne, Yunlong Li, Geert Van der Plas, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach

Ingrid De Wolf, Kris Croes, Christopher J. Wilson, 2011, Microelectron. Reliab..

High-resolution SILC measurements of thin SiO2 at ultra low voltages

Ben Kaczer, Robin Degraeve, Stefano Aresu, 2002, Microelectron. Reliab..

Matisse: A System-on-Chip Design Methodology Emphasizing Dynamic Memory Management

Hugo De Man, Chantal Ykman-Couvreur, Francky Catthoor, 1999, J. VLSI Signal Process..

Impact of oxide liner properties on TSV Cu pumping and TSV stress

Bart Vandevelde, Eric Beyne, Ingrid De Wolf, 2015, 2015 IEEE International Reliability Physics Symposium.