F. Seidel
发表
H. Bender,
N. Collaert,
C. Merckling,
2020,
ECS Journal of Solid State Science and Technology.
J. John,
W. Vandervorst,
P. Eyben,
2011
.
O. Richard,
H. Bender,
K. Temst,
2016
.
O. Richard,
H. Bender,
W. Vandervorst,
2017,
Ultramicroscopy.
O. Richard,
H. Bender,
F. Seidel,
2015
.
N. Horiguchi,
N. Jourdan,
N. Heylen,
2022,
International Interconnect Technology Conference.
H. Mertens,
A. Hikavyy,
Z. Tao,
2023,
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
H. Mertens,
R. Ritzenthaler,
A. Hikavyy,
2022,
2022 International Electron Devices Meeting (IEDM).
D. Tsvetanova,
N. Horiguchi,
J. Ryckaert,
2022,
International Electron Devices Meeting.
Wilfried Vandervorst,
Malgorzata Jurczak,
Hugo Bender,
2013,
ACS applied materials & interfaces.
B. Majeed,
D. Tezcan,
W. Vandervorst,
2014
.