L. Schaper

High capacitance density thin film integrated tantalum pentoxide decoupling capacitors

C. Thomason, L. Schaper, J. Morgan, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Z-axis interconnects using fine pitch, nanoscale through-silicon vias: Process development

P. Arunasalam, S. Spiesshoefer, S. Burkett, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Materials options for dielectrics in integrated capacitors

R. Ulrich, L. Schaper, L. Schaper, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Effect of via profile on copper seed layer deposition for electroplating

S. Burkett, L. Schaper, A. Kamto, 2007, 2007 IEEE Region 5 Technical Conference.