A. Binder
发表
P. Shea,
Balakrishnan Krishnan,
Sakeenah Khan,
2019,
ECS Journal of Solid State Science and Technology.
W. Yeh,
P. Shea,
Balakrishnan Krishnan,
2019,
Microelectronics Reliability.
Jiann-Shiun Yuan,
P. Shea,
A. Binder,
2018,
Superlattices and Microstructures.
S. Atcitty,
J. Flicker,
R. Kaplar,
2022,
Applied Physics Letters.
Rafael Perez Martinez,
J. Flicker,
R. Kaplar,
2022,
2022 IEEE International Reliability Physics Symposium (IRPS).
R. Kaplar,
G. Pickrell,
J. Dickerson,
2020,
2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
A. Allerman,
M. Crawford,
R. Kaplar,
2019,
2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).
S. Goodnick,
J. Flicker,
R. Kaplar,
2022,
Journal of Materials Research.
J. Gallagher,
A. Allerman,
M. Crawford,
2020,
Proposed for presentation at the Virtual 2020 Spring/Fall MRS meeting held November 27 - December 4, 2020..
A. Allerman,
M. Crawford,
R. Kaplar,
2021,
IEEE Workshop on Wide Bandgap Power Devices and Applications.
A. Allerman,
M. Crawford,
R. Kaplar,
2022,
IEEE Transactions on Electron Devices.
S. Mazumder,
S. Bahl,
T. Aichinger,
2023,
IEEE Journal of Emerging and Selected Topics in Power Electronics.
A. Allerman,
M. Crawford,
O. Aktas,
2020,
2020 IEEE International Electron Devices Meeting (IEDM).
O. Aktas,
D. Ji,
T. Anderson,
2022,
AIP Advances.
J. Flicker,
R. Kaplar,
A. Binder,
2022,
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).