B. Shieh

Impact of Joule heating on scaling of deep sub-micron Cu/low-k interconnects

Ting-Yen Chiang, K. Saraswat, K.C. Saraswat, 2002, 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).

Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps

Krishna C. Saraswat, Ratan K. Choudhury, Valeriy Sukharev, 2001, Microelectron. Reliab..

Air gaps lower k of interconnect dielectrics

K. Saraswat, J. McVittie, M. Deal, 1999 .

Air-gap formation during IMD deposition to lower interconnect capacitance

K. Saraswat, S. Nag, J. McVittie, 1998, IEEE Electron Device Letters.