H. Frémont
发表
A. Guedon-Gracia,
H. Fremont,
F. Verdier,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
G. N'Kaoua,
C. Pellet,
Y. Danto,
1997
.
F. Verdier,
B. Plano,
A. Guédon-Gracia,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
D. Benoit,
N. Rochat,
G. Imbert,
2020
.
J. Delétage,
F. Arabi,
H. Frémont,
2020
.
Hélène Fremont,
Yves Danto,
A. Fleury,
1995
.
Jean-Yves Delétage,
Hélène Fremont,
Frédéric Verdier,
2001
.
D. Benoit,
M. Rafik,
G. Imbert,
2019,
2019 IEEE International Integrated Reliability Workshop (IIRW).
H. Frémont,
A. Moujbani,
K. Weide-Zaage,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
E. Deloffre,
V. Balan,
S. Moreau,
2020,
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
P. Schwindenhammer,
H. Frémont,
C. Regard,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
E. Deloffre,
E. Souchier,
S. Moreau,
2022,
Microelectronic Engineering.
O. van der Sluis,
W. V. van Driel,
G. Zhang,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
S. Moreau,
S. Lhostis,
H. Combeau,
2022,
2022 IEEE International Reliability Physics Symposium (IRPS).
H. Frémont,
J. Schlobohm,
K. Weide-Zaage,
2013
.
Cristian Perra,
Jean-Marc Thiriet,
Michael H. W. Hoffmann,
2009
.
J. Delétage,
F. Arabi,
H. Frémont,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
D. Drouin,
Y. Ayadi,
É. Duchesne,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
A. Guédon-Gracia,
H. Frémont,
S. Pin,
2020
.
D. Drouin,
É. Duchesne,
H. Frémont,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
D. Drouin,
H. Frémont,
Quentin Vandier,
2022,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Bernard Plano,
Helene Fremont,
Mickael Pocheron,
2015,
IEEE Transactions on Device and Materials Reliability.
C. Nelson,
E. Lazear,
H. Frémont,
2014
.
Hélène Frémont,
Kirsten Weide-Zaage,
Geneviève Duchamp,
2014,
Microelectron. Reliab..
H. Frémont,
K. Weide-Zaage,
L. Meinshausen,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Hélène Frémont,
Kirsten Weide-Zaage,
Lutz Meinshausen,
2012,
Microelectron. Reliab..
Jean-Yves Delétage,
Alexandrine Guédon-Gracia,
Hélène Frémont,
2018,
Microelectron. Reliab..
A. Guédon-Gracia,
H. Frémont,
M. Berthou,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
J. Delétage,
H. Frémont,
A. Gracia,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Alexandrine Guédon-Gracia,
Hélène Frémont,
Maxime Berthou,
2009,
Microelectron. Reliab..
Hélène Frémont,
Kirsten Weide-Zaage,
Lutz Meinshausen,
2011,
Microelectron. Reliab..
Bernard Plano,
L. Meinshausen,
H. Frémont,
2015,
Microelectron. Reliab..
J. Delétage,
Y. Danto,
H. Frémont,
2004
.
Y. Danto,
H. Fremont,
M. Salagoity,
1998,
Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205).
S. Moreau,
S. Lhostis,
D. Bouchu,
2022,
ECS Journal of Solid State Science and Technology.
J. Delétage,
Y. Danto,
A. Pintus,
2001
.
O. van der Sluis,
W. V. van Driel,
K. Jansen,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
Xiaosong Ma,
Hélène Frémont,
Kaspar M. B. Jansen,
2009,
Microelectron. Reliab..
Hervé Morel,
Cyril Buttay,
Alexandrine Guédon-Gracia,
2017,
Microelectron. Reliab..
Y. Danto,
H. Frémont,
M. Brizoux,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
L. Arnaud,
E. Deloffre,
A. Farcy,
2018,
2018 IEEE International Electron Devices Meeting (IEDM).
Evaluation of quasi-hermetic packaging solutions for active microwave devices and space applications
P. Monfraix,
N. Labat,
H. Fremont,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
A. Guédon-Gracia,
H. Frémont,
P. Nguyen,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
J. Delétage,
A. Guédon-Gracia,
H. Frémont,
2021,
Microelectronics Reliability.
Alexandrine Guédon-Gracia,
Hélène Frémont,
Samed Barnat,
2012,
Microelectron. Reliab..
Jean-Yves Delétage,
Hélène Frémont,
J. B. Jullien,
2013,
Microelectron. Reliab..
Y. Danto,
Hélène Fremont,
Jean-Yves Deletage,
2000
.
J. Delétage,
B. Plano,
A. Guédon-Gracia,
2021,
Microelectronics Reliability.
Helene Fremont,
Catherine Bunel,
Samed Barnat,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
Xiaosong Ma,
Hélène Frémont,
Willem D. van Driel,
2010,
Microelectron. Reliab..
N. Malbert,
N. Labat,
H. Frémont,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
S. Moreau,
S. Lhostis,
H. Frémont,
2021,
Microelectronics Reliability.
E. Deloffre,
E. Souchier,
S. Moreau,
2022,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Helene Fremont,
H. Frémont,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Moreau,
S. Lhostis,
N. Bernier,
2021,
IEEE Electron Device Letters.
O. van der Sluis,
W. V. van Driel,
G. Zhang,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
Hélène Frémont,
Kirsten Weide-Zaage,
Walter Horaud,
2005,
Microelectron. Reliab..
Jean-Yves Delétage,
Hélène Fremont,
S. Pin,
2018,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
Alexandrine Guédon-Gracia,
Hélène Frémont,
S. Pin,
2017,
Microelectron. Reliab..
H. Frémont,
A. Gracia,
S. Pin,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Jean-Marc Thiriet,
Hélène Fremont,
Yahoui Hamed,
2006
.
A. Gracia,
H. Fremont,
H. Frémont,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).