D. Shi

A new method for equivalent acceleration of JEDEC moisture sensitivity levels

Xuejun Fan, Daniel Shi, B. Xie, 2008, 2008 58th Electronic Components and Technology Conference.

Parametric study of electroplating-based via-filling process for TSV applications

D. Shi, P. Sun, K. Tsui, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Design advisor for package-on-package (PoP) manufacturing

Peng Sun, Bin Xie, D. Shi, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Warpage reduction of package-on-package (PoP) module by material selection & process optimization

D. Shi, Peng Sun, V.C.-K. Leung, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.