S. Kallolimath

Investigation of Inter-Layer Dielectric (ILD) Failure by Hygroscopic Swelling

Jiang Zhou, S. Lahoti, M. Sitlani, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Investigation of nonuniform moisture distribution on determination of hygroscopic swelling coefficient and finite element modeling for a flip chip package

Jiang Zhou, Jiang Zhou, S. Lahoti, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..