X. Zhang

Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill

Hun Shen Ng, J. Teysseyre, Tong Yan Tee, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Stress in thermally annealed parylene films

J. McDonald, C. Apblett, X. Zhang, 1992 .

Dynamic Response of Epon 828/T-403 Under Multiaxial Loading at Various Temperatures

X. Zhang, Weinong W. Chen, 1997 .

Residual stress and fracture of thick dielectric films for power MEMS applications

X. Zhang, Xin Zhang, S.M. Spearing, 2002, Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).

Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance

V. Kripesh, D. Sohn, A. Tay, 2008, 2008 58th Electronic Components and Technology Conference.