M. Hunstig

发表

W. Sextro, T. Hemsel, M. Brökelmann, 2019, Sensors and Actuators A: Physical.

Walter Sextro, Simon Althoff, Tobias Meyer, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

W. Sextro, M. Brökelmann, T. Meyer, 2018, International Symposium on Microelectronics.

Venkatesh, S. Kaierle, L. Overmeyer, 2017 .

W. Sextro, T. Hemsel, M. Brökelmann, 2019, International Symposium on Microelectronics.

W. Sextro, T. Hemsel, Reinhard Schemmel, 2018, 2018 IEEE CPMT Symposium Japan (ICSJ).

W. Sextro, T. Hemsel, M. Brökelmann, 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC).

M. Brökelmann, M. Hunstig, A. Unger, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

Walter Sextro, Tobias Hemsel, Matthias Hunstig, 2012 .

Walter Sextro, Tobias Hemsel, Matthias Hunstig, 2010 .

Walter Sextro, Tobias Hemsel, Matthias Hunstig, 2013 .

W. Sextro, K. Guth, M. Hunstig, 2016, 2016 IEEE CPMT Symposium Japan (ICSJ).

Walter Sextro, Simon Althoff, Tobias Meyer, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).