K. Jacob

An improvement of thermal conductivity of underfill materials for flip-chip packages

Ching-Ping Wong, Ching-ping Wong, Haiying Li, 2003 .

Non-conventional Small-Scale Mechanical Testing of Materials

K. Jacob, A. Mishra, B. N. Jaya, 2022, Journal of the Indian Institute of Science.

High pressure torsion processing of maraging steel 250: Microstructure and mechanical behaviour evolution

A. Hohenwarter, S. Dixit, K. Jacob, 2020 .

Micro-mechanisms of failure in nano-structured maraging steels characterised through in situ mechanical tests

A. Hohenwarter, K. Jacob, B. N. Jaya, 2022, Nanotechnology.

Effect of Dislocation Network on Precipitate Morphology and Deformation Behaviour in Maraging steels: Modelling and Experimental Validation

K. Jacob, M. Gururajan, B. N. Jaya, 2022, Materialia.